SHUHEI AMAKAWA

Last Updated :2025/01/07

Affiliations, Positions
Graduate School of Advanced Science and Engineering, Professor
E-mail
amakawahiroshima-u.ac.jp

Basic Information

Educational Backgrounds

  • University of Cambridge, Department of Physics, United Kingdom, 1999/04, 2000/11
  • The University of Tokyo, Graduate School of Engineering, Japan, 1995/04, 2001/03
  • The University of Tokyo, Faculty of Engineering, Japan, 1993/04, 1995/03
  • The University of Tokyo, Japan, 1991/04, 1993/03

Academic Degrees

  • Master of Philosophy, University of Cambridge
  • Ph.D., The University of Tokyo
  • Master of Engineering, The University of Tokyo

Research Fields

  • Engineering;Electrical and electronic engineering;Communication / Network engineering
  • Engineering;Electrical and electronic engineering;Measurement engineering
  • Engineering;Electrical and electronic engineering;Electron device / Electronic equipment

Educational Activity

Course in Charge

  1. 2024, Undergraduate Education, 1Term, Electromagnetic Wave Propagation
  2. 2024, Undergraduate Education, 2Term, Semiconductor Device Engineering
  3. 2024, Undergraduate Education, Year, Graduation Thesis
  4. 2024, Graduate Education (Master's Program) , First Semester, Seminar on Electronics A
  5. 2024, Graduate Education (Master's Program) , Second Semester, Seminar on Electronics B
  6. 2024, Graduate Education (Master's Program) , Academic Year, Academic Presentation in Electronics
  7. 2024, Graduate Education (Master's Program) , 1Term, Exercises in Electronics A
  8. 2024, Graduate Education (Master's Program) , 2Term, Exercises in Electronics A
  9. 2024, Graduate Education (Master's Program) , 3Term, Exercises in Electronics B
  10. 2024, Graduate Education (Master's Program) , 4Term, Exercises in Electronics B
  11. 2024, Graduate Education (Master's Program) , 3Term, Physics of Electron Devices
  12. 2024, Graduate Education (Master's Program) , Academic Year, Advanced Study in Quantum Matter
  13. 2024, Graduate Education (Doctoral Program) , Academic Year, Advanced Study in Quantum Matter

Award of Education

  1. 2022/03/17, IEICE Educational Service Award, IEICE

Research Activities

Academic Papers

  1. A 20Gb/s QPSK receiver with mixed-signal carrier, timing, and data recovery using 3-bit ADCs, Custom Integrated Circuits Conference (CICC), 10-4-1-10-4-2, 20240424
    Link to Paper Search Results by DOI
  2. Nanoscale infrared polytype layer analysis and charge carrier profiling, Scientific Books of Abstracts, 8, 278-279, 20240929
  3. Nanoscale permittivity analysis in s-SNOM using a black-box calibration method, International Conference on Infrared, Millimeter, and Terahertz Waves, 1-2, 20240901
    Link to Paper Search Results by DOI
  4. Experimental study on transition loss of on-chip SIW interconnects and transmission lines using two de-embedding reference planes in 200 GHz band frequency, IEEE International Microwave Symposium, 694-697, 20240616
    Link to Paper Search Results by DOI
  5. A 300-GHz-band 40-Gb/s 2D phased-array CMOS transmitter with near-half-wave antenna pitch, IEEE Radio Frequency Integrated Circuits Symposium, 335-338, 20240617
    Link to Paper Search Results by DOI
  6. Calibration method for complex permittivity measurements using s-SNOM combining multiple probe tapping harmonics, Optics Express, 32(13), 23882-23893, 20240614
    Link to Paper Search Results by DOI
  7. 25.9-Gb/s 259-GHz phased-array CMOS receiver module with 28◦ steering range, IEEE Radio and Wireless Symposium, 1-4, 20240122
    Link to Paper Search Results by DOI
  8. Measurement and modeling for sub-THz CMOS design: Challenges and opportunities, Asia-Pacific Microwave Conference (APMC), 864-866, 20231208
    Link to Paper Search Results by DOI
  9. A 2D beam-steerable 252–285-GHz 25.8-Gbit/s CMOS receiver module, Asian Solid-State Circuits Conference (A-SSCC), 1-3, 20231105
    Link to Paper Search Results by DOI
  10. Implementation of low-loss sub-terahertz band substrate integrated waveguide-based interconnects and cavities in CMOS technology, XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), 1-4, 20230816
    Link to Paper Search Results by DOI
  11. Analysis of the Wilkinson coupler under different input conditions, XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), 1-4, 20230819
    Link to Paper Search Results by DOI
  12. A 58-%-lock-range divide-by-9 injection-locked frequency divider using harmonic-control technique, IEICE Transactions on Electronics, E106-C(10), 529-532, 20231001
    Link to Paper Search Results by DOI
  13. A 0.6-V 41.3-GHz power-scalable sub-sampling PLL in 55-nm CMOS DDC, IEICE Transactions on Electronics, E106-C(10), 533-537, 20231001
    Link to Paper Search Results by DOI
  14. Implementation of SIW cavity in commercial CMOS technology for sub-terahertz band applications, International Microwave Symposium, 493-496, 20230611
    Link to Paper Search Results by DOI
  15. Signal-flow-graph analysis of weakly nonlinear microwave circuits around a large-signal operating point, IEEE Transactions on Microwave Theory and Techniques, 71(9), 2722-2733, 20230901
    Link to Paper Search Results by DOI
  16. Implementation of SIW cavity in commercial CMOS technology for sub-terahertz band applications, IEEE International Microwave Symposium (IMS), 493-496, 20230611
    Link to Paper Search Results by DOI
  17. Variable-temperature broadband noise characterization of MOSFETs for cryogenic electronics: From room temperature down to 3K, 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM), 1-3, 20230310
    Link to Paper Search Results by DOI
  18. A transparent band-pass-filtered reflector for IEEE Standard 802.15.3d, Asia-Pacific Microwave Conference (APMC), 211-213, 20221129
  19. A 76-Gbit/s 265-GHz CMOS receiver with WR-3.4 waveguide interface, IEEE J. Solid-State Circuits, 57(10), 2988-2998, 20221001
    Link to Paper Search Results by DOI
  20. A 0.4-V 29-GHz-bandwidth power-scalable distributed amplifier in 55-nm CMOS DDC process, IEICE Trans. Electron., E105-C(10), 561-564, 20221001
    Link to Paper Search Results by DOI
  21. 29-to-65-GHz CMOS amplifier with tunable frequency response, International Symposium on Radio-Frequency Integration Technology (RFIT), 63-65, 20220830
    Link to Paper Search Results by DOI
  22. 254-GHz-to-299-GHz down conversion mixer using 45nm SOI CMOS, Midwest Symposium on Circuits and Systems (MWSCAS), 1-4, 20220808
  23. Demonstration of non-invasive probing of CMOS devices with aluminum pads at frequencies up to 500 GHz, 99th Automatic RF Techniques Group Microwave Measurement Conference (ARFTG), 1-4, 20220624
    Link to Paper Search Results by DOI
  24. 300-GHz back-radiation on-chip-antenna measurement with electromagnetic-wave-absorption sheet, International Conference on Microelectronic Test Structures (ICMTS), 1-5, 20220331
    Link to Paper Search Results by DOI
  25. A 30-to-70-GHz CMOS amplifier for 300-GHz heterodyne receivers, Asia-Pacific Microwave Conference, 184-186, 20211130
    Link to Paper Search Results by DOI
  26. A 76-Gbit/s 265-GHz CMOS receiver, Asian Solid-State Circuits Conference (A-SSCC), 1-3, 20211107
    Link to Paper Search Results by DOI
  27. Variable-temperature noise characterization of N-MOSFETs using an in-situ broadband amplifier, IEEE Journal the Electron Devices Society, 9, 1227-1236, 20210913
    Link to Paper Search Results by DOI
  28. A 272-GHz CMOS analog BPSK/QPSK demodulator for IEEE 802.15.3d, European Solid-State Circuits Conference (ESSCIRC), 415-418, 20210913
    Link to Paper Search Results by DOI
  29. A 258-GHz CMOS transmitter with phase-shifting architecture for phased-array systems, IEEE International Microwave Symposium (IMS), 705-708, 20210607
    Link to Paper Search Results by DOI
  30. 300-GHz-band OFDM video transmission with CMOS TX/RX modules and 40 dBi Cassegrain antenna toward 6G, IEICE Transactions on Electronics, E104-C(10), 576-586, 20211001
    Link to Paper Search Results by DOI
  31. A 32-Gb/s CMOS receiver with analog carrier recovery and synchronous QPSK demodulation, IEEE Microwave Components Letters, 31(6), 768-770, 20210601
    Link to Paper Search Results by DOI
  32. Direct white noise characterization of short-channel MOSFETs, IEEE Transactions on Electron Devices, 68(4), 1478-1482, 20210401
    Link to Paper Search Results by DOI
  33. White noise characterization of N-MOSFETs for physics-based cryogenic device modeling, IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 20210408
    Link to Paper Search Results by DOI
  34. Narrowband and low-loss bandpass filter for 5G built of silica-based post-wall waveguide, 2020 50th European Microwave Conference (EuMC), 559-562, 20210112
    Link to Paper Search Results by DOI
  35. A 32-Gb/s CMOS Receiver With Analog Carrier Recovery and Synchronous QPSK Demodulation, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 31(6), 768-770, 202106
    Link to Paper Search Results by DOI
  36. Theoretical study of optimal feedback LNA design, International Symposium on Radio-Frequency Integration Technology (RFIT), 201-203, 20200904
    Link to Paper Search Results by DOI
  37. 300-GHz CMOS-based wireless link using 40-dBi Cassegrain antenna for IEEE Standard 802.15.3d, International Symposium on Radio-Frequency Integration Technology (RFIT), 161-163, 20200903
    Link to Paper Search Results by DOI
  38. Effect of an electromagnetic wave absorber on 300-GHz short-range wireless communications, International Symposium on Radio-Frequency Integration Technology (RFIT), 108-110, 20200902
    Link to Paper Search Results by DOI
  39. Improvement method of power-added efficiency of multi-stage CMOS amplifiers in millimeter-wave band, International Symposium on Radio-Frequency Integration Technology (RFIT), 35-37, 20200902
    Link to Paper Search Results by DOI
  40. 300-GHz-band CMOS transmitter and receiver modules with WR-3.4 waveguide interface, IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G), 1-3, 20190815
  41. Theory of 2-port noise parameter transformation by lossless feedback and its application to LNA design, Thailand-Japan Microwave, 1-2, 20190628
  42. Highly configurable cylindrical-resonator-based bandpass filter built of silica-based post-wall waveguide and its application to compact E-band hybrid-coupled diplexer, IEEE International Microwave Symposium, 726-729, 201906
  43. A 6-mW-DC-power 300-GHz CMOS receiver for near-field wireless communications, IEEE International Microwave Symposium, 504-507, 201906
  44. Wideband power-line decoupling technique for millimeter-wave CMOS integrated circuits, IEEE International Symposium on Circuits and Systems, 1-4, 20190529
    Link to Paper Search Results by DOI
  45. Characteristic impedance determination up to THz frequencies in light of causality, Global Symposium on Millimeter Waves, 50-52, 20190523
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  46. An 80Gb/s 300GHz-band single-chip CMOS transceiver, International Solid-State Circuits Conference, 170-171, 20190219
    Link to Paper Search Results by DOI
  47. Causal characteristic impedance determination using calibration comparison and propagation constant, 92nd Automatic RF Techniques Group Microwave Measurement Conference, 1-6, 20190122
    Link to Paper Search Results by DOI
  48. A -40-dBc integrated-phase-noise 45-GHz sub-sampling PLL with 3.9-dBm output and 2.1% DC-to-RF efficiency, IEEE Radio Frequency Integrated Circuits Symposium, 175-178, 201906
  49. 300-GHz wireless data transmission system with low-SNR CMOS RF front end, Global Symposium on Millimeter Waves, 47-49, 20190523
    Link to Paper Search Results by DOI
  50. Half-mode-like parasitic transmission found in millimeter-wave bandpass filters realized in post-wall waveguide, European Microwave Conference in Central Europe, 1-4, 201905
  51. 300 GHz CMOS Transmitter Module for Terahertz Communication, J102-C(12), 348-355, 20191201
  52. An 80-Gb/s 300-GHz-band single-chip CMOS transceiver, IEEE Journal of Solid-State Circuits, 54(12), 3577-3588, 20191201
    Link to Paper Search Results by DOI
  53. Millimeter-wave CMOS amplifier with negative-capacitance feedback using half-wave transformer, International Symposium on Biomedical Engineering, 192-193, 20191114
  54. An 80-Gb/s 300-GHz-Band Single-Chip CMOS Transceiver, IEEE JOURNAL OF SOLID-STATE CIRCUITS, 54(12), 3577-3588, 201912
    Link to Paper Search Results by DOI
  55. 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB, IEEE Radio and Wireless Symposium (RWS), 154-156, 20180116
    Link to Paper Search Results by DOI
  56. 32-Gbit/s CMOS receivers in 300-GHz band, IEICE Transactions on Electronics, E101-C(7), 464-471, 20180701
    Link to Paper Search Results by DOI
  57. 300-GHz CMOS transceiver for terahertz wireless communication, Asia-Pacific Microwave Conference, 1-3, 20181107
    Link to Paper Search Results by DOI
  58. A 37-GHz-input divide-by-36 injection-locked frequency divider with 1.6-GHz lock range, Asian Solid-State Circuits Conference, 219-222, 201811
  59. Temperature dependence of bandpass filters built of silica-based post-wall waveguide for millimeter-wave applications, European Microwave Conference, 703-706, 20180926
    Link to Paper Search Results by DOI
  60. 300-GHz CMOS receiver module with WR-3.4 waveguide interface, European Microwave Conference, 396-399, 20180926
    Link to Paper Search Results by DOI
  61. A 239–315 GHz CMOS frequency doubler designed by using a small-signal harmonic model, European Microwave Integrated Circuits Conference, 109-112, 20180924
    Link to Paper Search Results by DOI
  62. 79–85 GHz CMOS amplifier with 0.35V supply voltage, European Microwave Integrated Circuits Conference, 37-40, 20180924
    Link to Paper Search Results by DOI
  63. A 300-uW K-band oscillator with high-Q open-stub capacitor in 55-nm CMOS DDC, International Symposium on Radio-Frequency Integration Technology, 1-3, 201808
    Link to Paper Search Results by DOI
  64. Integrated-Circuit Approaches to THz Communications: Challenges, Advances, and Future Prospects, IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES, E100A(2), 516-523, 201702
    Link to Paper Search Results by DOI
  65. A 105Gb/s 300GHz CMOS transmitter, International Solid-State Circuits Conference (ISSCC), 308-309, 2017
    Link to Paper Search Results by DOI
  66. DC and RF characterization　of RF MOSFET embedding structure, International Conference on Microelectronic Test Structures (ICMTS), 103-107, 2017
    Link to Paper Search Results by DOI
  67. Causal transmission line model incorporating frequency-dependent linear resistors, 21st IEEE Workshop on Signal and Power Integrity (SPI), 1-4, 2017
    Link to Paper Search Results by DOI
  68. Prescriptions for identifying the definition of complex-referenced S-parameters in commercial EM simulators, The 38th PIERS in St Petersburg, 264-265, 2017
  69. An 80–106 GHz CMOS amplifier with 0.5V supply voltage, IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 308-311, 2017
    Link to Paper Search Results by DOI
  70. 56-Gbit/s 16-QAM wireless link with 300-GHz-band CMOS transmitter, IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2017
  71. A 32Gbit/s 16QAM CMOS receiver in 300GHz band, IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2017
  72. How does my microwave/EM simulator define complex-referenced S-parameters?, Vietnam-Japan Microwave (VJMW), 112-115, 20170614
  73. Noise-figure optimization of a multi-stage millimeter-wave amplifier with negative capacitance feedback, Thailand-Japan Microwave (TJMW), 1-2, 20170615
  74. A 416-mW 32-Gbit/s 300-GHz CMOS receiver, International Symposium on Radio-Frequency Integration Technology (RFIT), 65-67, 2017
    Link to Paper Search Results by DOI
  75. 2.37-dBm-output 288–310 GHz frequency multiplier in 40 nm CMOS, International Symposium on Radio-Frequency Integration Technology (RFIT), 28-30, 2017
    Link to Paper Search Results by DOI
  76. An E-band hybrid-coupled diplexer built of silica-based post-wall waveguide, European Microwave Conference (EuMC), 819-822, 20171011
    Link to Paper Search Results by DOI
  77. A 40 dB peak gain, wideband, low noise intermediate frequency (IF) amplifier, Asia-Pacific Microwave Conference (APMC), 622-625, 2017
    Link to Paper Search Results by DOI
  78. A 300GHz 40nm CMOS transmitter with 32-QAM 17.5Gb/s/ch capability over 6 channels, International Solid-State Circuits Conference (ISSCC), 342-343, 20160203
    Link to Paper Search Results by DOI
  79. A QAM-capable 300-GHz CMOS transmitter, International Workshop on Smart Wireless Communications (SmartCom), 39-46, 20160517
  80. Design Method of Gain-Boosted Small-Signal Amplifiers with Lossless Reciprocal Feedback, TECHNICAL REPORT OF IEICE, 115(476), 181-186, 20160304
  81. Evaluation of low characteristic impedance transmission line for millimeter-wave decoupling, Technical Report of IEICE, 115(476), 163-167, 20160304
  82. Design of differential type microstrip line-to-waveguide transitions for 300GHz, IEICE Technical Report, 115(476), 169-173, 20160304
  83. Theoretical analysis of a frequency tripler-based mixer, IEICE Technical Report, 115(476), 175-179, 20160304
  84. Wireless digital data transmission from a 300 GHz CMOS transmitter, Electronics Letters, 52(15), 1353-1355, 20160721
    Link to Paper Search Results by DOI
  85. Millimeter-wave characteristics of coplanar waveguide on GaAs substrate, Thailand-Japan Microwave (TJMW), 20160609
  86. Scattered Reflections on Scattering Parameters -Demystifying Complex-Referenced S Parameters-, IEICE TRANSACTIONS ON ELECTRONICS, E99C(10), 1100-1112, 201610
    Link to Paper Search Results by DOI
  87. Compact 141-GHz Differential Amplifier with 20-dB Peak Gain and 22-GHz 3-dB Bandwidth, IEICE TRANSACTIONS ON ELECTRONICS, E99C(10), 1156-1163, 201610
    Link to Paper Search Results by DOI
  88. A 300 GHz CMOS Transmitter With 32-QAM 17.5 Gb/s/ch Capability Over Six Channels, IEEE JOURNAL OF SOLID-STATE CIRCUITS, 51(12), 3037-3048, 201612
    Link to Paper Search Results by DOI
  89. Quintic mixer: A subharmonic up-conversion mixer for THz transmitter supporting complex digital modulation, IEEE MTT-S International Microwave Symposium (IMS), 1-3, 2016
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  90. CMOS 300-GHz 64-QAM transmitter, IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016
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  91. System-level evaluation of 300GHz CMOS wireless transmitter using cubic mixer, International Symposium on Radio-Frequency Integration Technology (RFIT), 1-3, 2016
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  92. 14.4-dB CMOS D-band low-noise amplifier with 22.6-mW power consumption utilizing bias-optimization technique, International Symposium on Radio-Frequency Integration Technology (RFIT), 1-3, 2016
    Link to Paper Search Results by DOI
  93. A 300-GHz 64-QAM CMOS transmitter with 21-Gb/s maximum per-channel data rate, European Microwave Integrated Circuits Conference (EuMIC), 193-196, 2016
    Link to Paper Search Results by DOI
  94. Power spectrum analysis of a tripler-based 300-GHz CMOS upconversion mixer, European Microwave Conference (EuMC), 345-348, 2016
    Link to Paper Search Results by DOI
  95. Graphical approach to analysis and design of gain-boosted near-fmax feedback amplifiers, European Microwave Conference (EuMC), 1039-1042, 2016
    Link to Paper Search Results by DOI
  96. 続S パラメータ利用の落とし穴:VNA キャリブレーションとは何か（穴にはまった人からの報告）, MWEワークショップダイジェスト, 1-6, 2016
  97. Characterization of wideband decoupling power line with extremely low characteristic impedance for millimeter-wave CMOS circuits, International Conference on Microelectronic Test Structures (ICMTS), 2015(-), 220-223, 20150323
    Link to Paper Search Results by DOI
  98. Systematic calibration procedure of process parameters for electromagnetic field analysis of millimeter-wave CMOS devices, International Conference on Microelectronic Test Structures (ICMTS), 2015(-), 230-234, 20150323
    Link to Paper Search Results by DOI
  99. C-2-55 A Millimeter-wave Bandpass Filter with Microstrip-Interface Realized by Post-Wall Waveguide, Proceedings of the IEICE General Conference, 2015(1), 20150224
  100. Tips for precise on-wafer measurement in the terahertz region, 84(5), 453-457, 20150501
  101. Recent progress and prospects of terahertz CMOS, IEICE Electron. Express, 12(13), 1-7, 20150710
    Link to Paper Search Results by DOI
  102. Tehrahertz CMOS Design for Low-Power and High-Speed Wireless Communication, IEICE TRANSACTIONS ON ELECTRONICS, E98C(12), 1091-1104, 201512
    Link to Paper Search Results by DOI
  103. Compact 160-GHz amplifier with 15-dB peak gain and 41-GHz 3-dB bandwidth, IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 7-10, 20150519
    Link to Paper Search Results by DOI
  104. 300-GHz MOSFET model extracted by an accurate cold-bias de-embedding technique, IEEE MTT-S International Microwave Symposium (IMS), 20150519
  105. Compact and low-loss bandpass filter realized in silica-based post-wall waveguide for 60-GHz applications, IEEE MTT-S International Microwave Symposium (IMS), 20150521
    Link to Paper Search Results by DOI
  106. Wideband CMOS decoupling power line for millimeter-wave applications, IEEE MTT-S International Microwave Symposium (IMS), 20150521
    Link to Paper Search Results by DOI
  107. Low-loss silicabased bandpass filter for 60-GHz applications, Thailand-Japan Microwave (TJMW), 20150807
  108. Power line decoupling up to 325 GHz in CMOS, Thailand-Japan Microwave (TJMW), 20150808
  109. Power line decoupling up to 325 GHz in CMOS, Vietnam-Japan Microwave (VJMW), 20150810
  110. Compact 138-GHz amplifier with 18-dB peak gain and 27-GHz 3-dB bandwidth, International Symposium on Radio-Frequency Integration Technology (RFIT), 55-57, 20150827
    Link to Paper Search Results by DOI
  111. Comparative analysis of on-chip transmission line de-embedding techniques, International Symposium on Radio-Frequency Integration Technology (RFIT), 91-93, 20150827
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  112. Calibration of process parameters for electromagnetic field analysis of CMOS devices up to 330 GHz, International Symposium on Radio-Frequency Integration Technology (RFIT), 94-96, 20150827
    Link to Paper Search Results by DOI
  113. Parasitic conscious 54 GHz divide-by-4 injection-locked frequency divider, International Symposium on Radio-Frequency Integration Technology (RFIT), 103-105, 20150827
    Link to Paper Search Results by DOI
  114. Modeling of wideband decoupling power line for millimeter-wave CMOS circuits, International Symposium on Radio-Frequency Integration Technology (RFIT), 151-153, 20150828
    Link to Paper Search Results by DOI
  115. 124-GHz CMOS quadrature voltage-controlled oscillator with fundamental injection locking, Asian Solid-State Circuits Conference (A-SSCC), 77-80, 20151110
    Link to Paper Search Results by DOI
  116. Demystifying S parameters: Confusion surrounding S-parameter definitions, MWE 2015 Workshop Digest, 20151127
  117. Compact 141-GHz differential amplifier with 20-dB peak gain and 22-GHz 3-dB bandwidth, IEICE Technical Report, 115(387), 1-6, 20151221
  118. E-Band 65 nm CMOS Low-Noise Amplifier Design Using Gain-Boost Technique, IEICE TRANSACTIONS ON ELECTRONICS, E97-C(6), 476-485, 20140601
    Link to Paper Search Results by DOI
  119. Design of CMOS resonating push-push frequency doubler, IEICE Wabun Rombunshi C, J97-C(12), 484-491, 20141201
  120. On-wafer transmission line measurement above 100 GHz, Thailand-Japan Microwave (TJMW), 2014(-), 1-2, 20141127
  121. Millimeterwave CMOS transmission-line-to-waveguide transition for 220–325 GHz, Thailand-Japan Microwave (TJMW), 2014(-), 1-2, 20141127
  122. Theory of gain and stability of small-signal amplifiers with lossless reciprocal feedback, Asia-Pacific Microwave Conference (APMC), 2014(-), 1184-1186, 20141107
  123. Analytical design of small-signal amplifier with maximum gain in conditionally stable region, Asia-Pacific Microwave Conference (APMC), 2014(-), 774-776, 20141107
  124. 79 GHz CMOS power amplifier considering time- and temperature-degradation model, Asia-Pacific Microwave Conference (APMC), 2014(-), 637-639, 20141107
  125. Diode modeling with lossy nonlinear capacitance model, International Conference on Solid State Devices and Materials (SSDM), 2014(-), 96-97, 20140901
  126. Design of CMOS resonating push-push frequency doubler, International Meeting for Future Electron Devices Kansai (IMFEDK), 2014(-), 1-2, 20140619
    Link to Paper Search Results by DOI
  127. Design of millimeter-wave CMOS transmission-line-to-waveguide transitions, International Meeting for Future Electron Devices Kansai (IMFEDK), 2014(-), 1-2, 20140619
    Link to Paper Search Results by DOI
  128. Evaluation of CMOS differential transmission lines as two-port networks with on-chip baluns in millimeter-wave band, 83rd Automatic RF Techniques Group Conference (ARFTG), 2014(-), 1-5, 20140606
    Link to Paper Search Results by DOI
  129. Small signal model considering hot-carrier effect for millimeter-wave frequencies, 7th Global Symposium on Millimeter-Waves (GSMM), 2014(-), 131-132, 20140501
  130. Gain-boosted E-band low-noise amplifier, 7th Global Symposium on Millimeter-Waves (GSMM), 2014(-), 117-118, 20140501
  131. Design of well-behaved low-loss millimetre-wave CMOS transmission lines, 18th IEEE Workshop on Signal and Power Integrity (SPI), 2014(-), 1-4, 20140512
    Link to Paper Search Results by DOI
  132. Diode Modeling with Lossy Nonlinear Capacitance Model, Technical report of IEICE. ICD, 113(419), 20140121
  133. Design of CMOS Transmission Line-to-Waveguide Transitions from Milimeter Wave, Technical report of IEICE. ICD, 113(419), 20140121
  134. Drain Matching CMOS Millimeter-wave Frequency Doubler, Technical report of IEICE. ICD, 113(419), 20140121
  135. Characterization of low-characteristic-impedance decoupling transmission line, IEICE technical report. Microwaves, 113(460), 29-34, 20140225
  136. On-wafer de-embedding pattern design for reduced uncertainty under an area constraint, IEICE technical report. Microwaves, 113(460), 35-40, 20140225
  137. Matching circuit for CMOS millimeter-wave frequency doubler, IEICE technical report. Microwaves, 113(460), 41-46, 20140225
  138. Consideration about Extremely High Frequency CMOS Amplification Circuit which is Wideband, IEICE technical report. Microwaves, 113(460), 47-51, 20140225
  139. C-12-50 Diode Modeling with Lossy Nonlinear Capacitance Model, Proceedings of the IEICE General Conference, 2014(2), 20140304
  140. C-2-1 Temperature Compensation of CMOS Power Amplifier for 79GHz Radar System, Proceedings of the IEICE General Conference, 2014(1), 20140304
  141. C-2-36 Study for Gain of Small-Signal Amplifier at Conditionally Stable Region, Proceedings of the IEICE General Conference, 2014(1), 20140304
  142. C-2-61 The Effect on the Device Evaluation Results of Measurement Variability in the Millimeter-wave CMOS On-Chip De-embedding, Proceedings of the IEICE General Conference, 2014(1), 20140304
  143. C-2-92 CMOS Microstrip Line-to-WR3.4 Waveguide Transitions, Proceedings of the IEICE General Conference, 2014(1), 20140304
  144. C-2-103 Study of Dummy Generation Method for Transmission Line on CMOS Circuit, Proceedings of the IEICE General Conference, 2014(1), 20140304
  145. C-2-1 Relationship between Size of Buffer and Maximum Oscillation Frequency in Ring Oscillator, Proceedings of the Society Conference of IEICE, 2014(1), 20140909
  146. C-2-22 Multi-Stage CMOS Amplifier with Flat Gain Response, Proceedings of the Society Conference of IEICE, 2014(1), 20140909
  147. C-2-39 CMOS transmission Line-to-Waveguide Transitions with coaxial structure, Proceedings of the Society Conference of IEICE, 2014(1), 20140909
  148. C-2-70 Injection-Locked-Oscillator-Based Phase Shifter with High Phase Resolution, Proceedings of the Society Conference of IEICE, 2014(1), 20140909
  149. C-12-31 Evaluation of Uncertainty at On-Wafer Measurement of CMOS Millimeter-Wave Integrated Circuits, Proceedings of the Society Conference of IEICE, 2014(2), 20140909
  150. On the length of THRU standard for TRL de-embedding on Si substrate above 110 GHz, International Conference on Microelectronic Test Structures (ICMTS), 2013(-), 81-86, 20130301
    Link to Paper Search Results by DOI
  151. Modeling of Short-Millimeter-Wave CMOS Transmission Line with Lossy Dielectrics with Specific Absorption Spectrum, IEICE TRANSACTIONS ON ELECTRONICS, E96-C(10), 1311-1318, 20131001
    Link to Paper Search Results by DOI
  152. An inductorless cascaded phase-locked loop with pulse injection locking technique in 90 nm CMOS, International Journal of Microwave Science and Technology, 2013(584341), 1-11, 20130121
    Link to Paper Search Results by DOI
  153. Scattering matrix normalized to a nondiagonal reference impedance matrix, IEICE technical report. Microwaves, 112(459), 37-38, 20130227
  154. Relations of Gain and Stability in terms of the Parameter μ, Proceedings of the Society Conference of IEICE, 2013(1), 20130903
  155. Design of Matching Network with a Transformer, Proceedings of the Society Conference of IEICE, 2013(1), 20130903
  156. C-2-37 Design for Maximum FOM of 79GHz Power Amplifier with Temperature Compensation, Proceedings of the Society Conference of IEICE, 2013(1), 20130903
  157. Selection of Process Parameters in Electromagnetic Field Analysis, Proceedings of the Society Conference of IEICE, 2013(1), 20130903
  158. Study on the Structure of CMOS Transmission Lines for Short-Millimeter-Wave Band, Proceedings of the Society Conference of IEICE, 2013(1), 20130903
  159. Study on the Length of THRU Used in CMOS On-Chip Deembedding, Proceedings of the Society Conference of IEICE, 2013(1), 20130903
  160. A Study of Modeling of Non-linear Capacitors in the Diode, Proceedings of the Society Conference of IEICE, 2013(2), 20130903
  161. Study on the Length ofthe Zero-Ohm Transmission Line in Millimeter-Wave CMOS Circuits, Proceedings of the Society Conference of IEICE, 2013(2), 20130903
  162. Characteristic impedance determination technique for CMOS on-wafer transmission line with large substrate loss, 79th Automatic RF Techniques Group Conf. (ARFTG), 2012(-), -, 20120601
    Link to Paper Search Results by DOI
  163. On the choice of cascade de-embedding methods for on-wafer S-parameter measurement, International Symposium on Radio-Frequency Integration Technology (RFIT), 2012(-), 137-139, 20121101
    Link to Paper Search Results by DOI
  164. RF signal generator using time domain harmonic suppression technique in 90 nm CMOS, IEICE Electronics Express, 9(4), 270-275, 20120225
    Link to Paper Search Results by DOI
  165. 1.2–17.6 GHz ring-oscillator-based phase-locked loop with injection locking in 65 nm complementary metal oxide semiconductor, Japanese Journal of Applied Physics, 51(2S), 02BE03, 20120220
    Link to Paper Search Results by DOI
  166. Universal Relationship between Substrate Current and History Effect in Silicon-on-Insulator Metal-Oxide-Semiconductor Field-Effect Transistors, JAPANESE JOURNAL OF APPLIED PHYSICS, 50(4), 20110420
    Link to Paper Search Results by DOI
  167. Modeling of Reduced Surface Field Laterally Diffused Metal Oxide Semiconductor for Accurate Prediction of Junction Condition on Device Characteristics, JAPANESE JOURNAL OF APPLIED PHYSICS, 50(4), 20110420
    Link to Paper Search Results by DOI
  168. Interconnect design challenges in nano CMOS circuit, Key Engineering Materials, 470, 224-230, 20110201
  169. Universal Relationship between Substrate Current and History Effect in Silicon-on-Insulator Metal-Oxide-Semiconductor Field-Effect Transistors, Jpn. J. Appl. Phys. (JJAP), 50, 04DC12, 20110401
  170. Modeling of Reduced Surface Field Laterally Diffused Metal Oxide Semiconductor for Accurate Prediction of Junction Condition on Device Characteristics, Jpn. J. Appl. Phys. (JJAP), 50, 1-5, 20110401
  171. 2.4-10 GHz low-noise injection-locked ring voltage controlled oscillator in 90 nm complementary metal oxide semiconductor, Jpn. J. Appl. Phys. (JJAP), 50(4), 04DE03 (1-5), 20110401
  172. A study of digitally controllable radio frequency micro electro mechanical systems inductor, Jpn. J. Appl. Phys. (JJAP), 50(5), 05EE01, 20110501
    Link to Paper Search Results by DOI
  173. High frequency transmission characteristics of the interconnects stacked into the 3D IC configuration, The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, 14(6), 501-506, 20110901
  174. RF CMOS Integrated Circuit: History, Current Status and Future Prospects, IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES, E94-A(2), 556-567, 20110201
    Link to Paper Search Results by DOI
  175. C-12-11 An Inductorless Phase-Locked Loop with an Injection Locking Technique, Proceedings of the IEICE General Conference, 2011(2), 20110228
  176. C-12-23 A Study of Inverter-based RF CMOS Low Noise Amplifier Scalability in CMOS Process, Proceedings of the IEICE General Conference, 2011(2), 20110228
  177. C-12-36 A High Voltage CMOS Charge Pump Circuit for MEMS Electrostatic Actuators, Proceedings of the IEICE General Conference, 2011(2), 20110228
  178. Challenges and Opportunities of RF CMOS in Wireless Communication, The Journal of the Institute of Electronics, Information, and Communication Engineers, 94(5), 427-432, 20110501
  179. RF signal generator based on time-to-analog converter using multi-ring oscillators in 90nm CMOS, International Conference on Solid State Devices and Materials, 103-104, 20100901
  180. Wideband, high-linearity low-noise amplifier design in sub-micrometer CMOS technology, Progress In Electromagnetics Research Symposium, 727-728, 20100701
  181. Wide-frequency-range low-noise injection-locked ring VCO for UWB applications in 90 nm CMOS, International Conference on Solid State Devices and Materials, 109-110, 20100901
  182. Inductorless 8.9mW 25 Gb/s 1:4 DEMUX and 4mW 13 Gb/s 4:1 MUX in 90 nm CMOS, J. Semicond. Technol. Sci., 10(3), 404-407, 20100901
  183. Interconnect challenges in nano CMOS circuit, International Symposium on Technology Evolution for Silicon Nano-Electronics, 28, 20100601
  184. Physical design challenge in nanoscale CMOS RF circuit, International Symposium on Technology Evolution for Silicon Nano-Electronics, 39, 20100601
  185. Digitally controllable RF MEMS inductor, Advanced Metallization Conference, 20101001
  186. Universal relationship between settling time of floating-body SOI MOSFETs and the substrate current in their body-tied counterparts, International Conference on Solid State Devices and Materials, 1013-1014, 20100901
  187. A wearably small low-power wireless pH sensor module incorporating an ion-sensitive field-effect transistor field-effect transistor, International Meeting on Chemical Sensors, 378, 20100701
  188. High-frequency half-integral subharmonic locked ring-VCO-based scalable PLL in 90 nm CMOS, Asia-Pacific Microwave Conference, 586-589, 20101201
  189. Design of on-chip high speed interconnect on complementary metal oxide semiconductor 180 nm technology, Japanese Journal of Applied Physics, 49, 04DE14, 20100401
  190. Radio frequency micro electro mechanical systems inductor configurations for achieving large inductance variations and high Q-factors, Japanese Journal of Applied Physics, 49, 05FG02, 20100501
  191. Highly energy-efficient on-chip pulsed-current-mode transmission line interconnect, Solid State Circuit Technologies, 263-280, 20100101
  192. A thru-only de-embedding method for on-wafer characterization of multiport networks, Advanced Microwave Circuits and Systems, 13-32, 20100401
    Link to Paper Search Results by DOI
  193. Design of on-chip high speed interconnect on complementary metal oxide semiconductor 180 nm technology, Japanese Journal of Applied Physics, 49, 04DE14, 20100401
  194. A Universal Equivalent Circuit Model for Ceramic Capacitors, IEICE Trans. Electron., 93(3), 347-354, 20100301
  195. C-12-2 A Digital Based Scalable QPSK RF Modulator, Proceedings of the IEICE General Conference, 2010(2), 20100302
  196. C-12-3 Investigation of CMOS QPSK RF Signal Generator using Injection Locking, Proceedings of the IEICE General Conference, 2010(2), 20100302
  197. C-12-12 Wide-Band, Linear Low Noise Amplifier Design, Proceedings of the IEICE General Conference, 2010(2), 20100302
  198. C-12-13 Study of High-Gain and Wideband RF Variable Gain Amplifier based on CMOS Inverter Topology, Proceedings of the IEICE General Conference, 2010(2), 20100302
  199. C-12-17 A 2.8-11 GHz Wideband Differential Ring-VCO, Proceedings of the IEICE General Conference, 2010(2), 20100302
  200. C-12-58 A Study of MUX/DEMUX With Clocked Inverter Type D-FF, Proceedings of the IEICE General Conference, 2010(2), 20100302
  201. C-12-59 Performance Comparison of High-Speed Digital Signal Transmission Characteristics between RC Line and Transmission Line, Proceedings of the IEICE General Conference, 2010(2), 20100302
  202. A-1-42 Wireless pH sensor module with an ISFET, Proceedings of the IEICE General Conference, 2010, 20100302
  203. C-12-15 A Study of High-Speed Low-Power MUX/DEMUX in chips, Proceedings of the Society Conference of IEICE, 2010(2), 20100831
  204. C-12-31 Investigation of RF Signal Generator Using CMOS Multi-Ring Oscillators, Proceedings of the Society Conference of IEICE, 2010(2), 20100831
  205. C-12-32 A Scalable Wideband Ring-VCO with Injection Locking, Proceedings of the Society Conference of IEICE, 2010(2), 20100831
  206. C-12-36 A Low-Phase-Noise Ring-VCO-Based PLL with Injection Locking, Proceedings of the Society Conference of IEICE, 2010(2), 20100831
  207. C-12-37 CMOS Inverter-based Wideband LNA in 65nm Technology, Proceedings of the Society Conference of IEICE, 2010(2), 20100831
  208. C-12-43 CMOS Power Amplifier in 65nm Technology, Proceedings of the Society Conference of IEICE, 2010(2), 20100831
  209. C-12-44 Measurement results of Wideband RF 2 Step Gain Amplifier, Proceedings of the Society Conference of IEICE, 2010(2), 20100831
  210. C-12-50 Low-power wireless pH sensing FM transmitter IC with Ion Sensitive Field Effect Transistor, Proceedings of the Society Conference of IEICE, 2010(2), 20100831
  211. Development of High-Frequency Inductors Using Wafer-Level Packaging Technology and Its Circuit Application, The transactions of the Institute of Electronics, Information and Communication Engineers. C, J93-C(11), 477-484, 20101101
  212. A Fusion of CMOS Integrated Circuit with MEMS, The Journal of the Institute of Electronics, Information, and Communication Engineers, 93(11), 928-932, 20101101
  213. Physical design challenges to nano-CMOS circuits, IEICE Electronics Express, 6(11), 703-720, 20090701
    Link to Paper Search Results by DOI
  214. C-12-26 Design of Coplanar-Strip Differential Transmission Line on Si Substrate, Proceedings of the IEICE General Conference, 2009(2), 20090304
  215. C-12-60 Investigation of Scalable Wideband RF CMOS Low Noise Amplifier Using Inveter Construction, Proceedings of the IEICE General Conference, 2009(2), 20090304
  216. C-12-50 Investigation of CMOS LC-VCO on Process Generation Relativity, Proceedings of the IEICE General Conference, 2009(2), 20090304
  217. C-12-33 Design of an On-Chip Low-Jitter Inverter Buffer Using Feedback Resister, Proceedings of the IEICE General Conference, 2009(2), 20090304
  218. C-12-29 A Comparison of On-chip/Off-chip Inductors for Enhancement of Performance of RF CMOS Circuits, Proceedings of the IEICE General Conference, 2009(2), 20090304
  219. Inter-Chip Wiring Technology for 3-D LSI, 73, 57-60, 20090709
  220. RF CMOS Integrated Circuit : Reconfigurability and Scalability, IEICE technical report, 109(155), 165-166, 20090722
  221. C-12-16 Inductorless Wideband RF CMOS Low-Noise Amplifier based CMOS Inveter, Proceedings of the Society Conference of IEICE, 2009(2), 20090901
  222. C-12-17 Evaluation of a CMOS-Inverter-Based Wideband Variable Gain Amplifier, Proceedings of the Society Conference of IEICE, 2009(2), 20090901
  223. C-12-22 Investigation of CMOS RF Signal Generator Based on Time To Analog Converter, Proceedings of the Society Conference of IEICE, 2009(2), 20090901
  224. C-12-23 A Scalable Wideband RF QPSK Modulator, Proceedings of the Society Conference of IEICE, 2009(2), 20090901
  225. C-12-25 Frequency Tuning Range broadening of CMOS I/Q Ring-VCO, Proceedings of the Society Conference of IEICE, 2009(2), 20090901
  226. C-12-52 4:1 MUX Design for On-Chip Serial Transmission, Proceedings of the Society Conference of IEICE, 2009(2), 20090901
  227. C-12-53 Performance comparison of transmission characteristics between on-chip transmission line and RC line adapting capacitive pre-emphasis technique, Proceedings of the Society Conference of IEICE, 2009(2), 20090901
  228. Inter-Chip Wiring Technology for 3-D LSI, Electrochemistry, 77(9), 812-817, 20090905
  229. Single-parameter nonadiabatic quantized charge pumping, Physical Review B, 77, 153301, 20080401
    Link to Paper Search Results by DOI
  230. Layout-aware compact model of MOSFET characteristics variations induced by STI stress, IEICE Transactions on Electronics, E91-C(7), 1142-1150, 20080701
  231. 21401 Challenges in LSI scaling in light of interconnect resource requirements, 2008(14), 381-382, 20080313
  232. C-2-14 A CMOS-Inverter-Based Wideband Variable Gain Amplifier, Proceedings of the Society Conference of IEICE, 2008(1), 20080902
  233. C-12-45 RF CMOS Low Noise Amplifier Dependencies on Process Generation, Proceedings of the Society Conference of IEICE, 2008(2), 20080902
  234. C-2-57 Dependence on Process Generation of CMOS RF Power Amplifier, Proceedings of the Society Conference of IEICE, 2008(2), 20080902
  235. A-1-12 Wide Band CMOS Differential Type Ring VCO, Proceedings of the Society Conference of IEICE, 2008, 20080902
  236. A wire-length distribution that models moderate-angled sectioning and underoccupancy of core area, Proceedings of the IEICE General Conference, 2007, 20070307
  237. C-2-86 An Effective Attenuation that Includes Crosstalk from Wirings with Various Attenuation Characteristics, Proceedings of the Society Conference of IEICE, 2007(1), 20070829
  238. Nanosilicon for single-electron devices, Current Applied Physics, 4, 98-101, 20040401
  239. Single-electron logic based on multiple-tunnel junctions, Mesoscopic Tunneling Devices, 2004, 71-104, 20040801
  240. Cross-coupling in Coulomb blockade circuits: Bidirectional electron pump, Journal of Applied Physics, 94(5), 3194-3200, 20030901
  241. Nanoscale Coulomb blockade memory and logic devices, Nanotechnology, 12(2), 155-159, 20010601
  242. Charging and retention times in silicon-floating-dot-single-electron memory, Japanese Journal of Applied Physics, 40(3B), 2041-2045, 20010301
    Link to Paper Search Results by DOI
  243. Analysis of multiphase clocked electron pumps consisting of single-electron transistors, Journal of Applied Physics, 89(9), 5001-5008, 20010501
    Link to Paper Search Results by DOI
  244. Characteristics of two Coulomb blockade transistors separated by an island to which an oscillating potential is applied: theory and experiment, Applied Physics Letters, 79(4), 533-535, 20010701
  245. Scaling of the single-electron tunnelling current through ultrasmall tunnel junctions, Journal of Physics: Condensed Matter, 12(32), 7223-7228, 20000801
    Link to Paper Search Results by DOI
  246. Single-electron circuit simulation, IEICE Transactions on Electronics, E81-C(1), 21-29, 19980125
  247. Circuit simulator aiming at single-electron integration, Japanese Journal of Applied Physics, 37(3B), 1478-1482, 19980301
    Link to Paper Search Results by DOI
  248. Correlated electron-hole transport in capacitively-coupled one-dimensional tunnel junction arrays, Japanese Journal of Applied Physics, 36(6B), 4166-4171, 19970601
    Link to Paper Search Results by DOI
  249. Proposal of a Schottky-barrier SET aiming at a future integrated device, IEICE Transactions on Electronics, E80-C(7), 881-885, 19970701
  250. Estimation of cotunneling in single-electron logic and its suppression, Japanese Journal of Applied Physics, 35(2B), 1146-1150, 19960201
    Link to Paper Search Results by DOI
  251. Cotunneling-tolerant single-electron logic, Extended Abstracts of the 1995 International Conference on Solid State Devices and Materials (SSDM), 207-209, 19950901
  252. Design of CMOS on-chip antenna in 300-GHz band, 116(486), 95-100, 20170303

Publications such as books

  1. 2024/10/31, Elementary Semiconductor Device Physics, CRC Press, 2024, Scholarly Book, Joint work, English, Kazuya Masu and Shuhei Amakawa, 9781032574479
    Amazon URL
  2. 2020/11/20, Elementary Solid-State Device Physics, 2020, November, Scholarly Book, Joint work, 日本語, 9784339018097
    Amazon URL
  3. 2019/08/19, Design of Terahertz CMOS Integrated Circuits for High-Speed Wireless Communication, IET, 2019, 201908, Scholarly Book, Joint work, English, M. Fujishima and S. Amakawa, 1785613871
    Amazon URL
  4. 2005/07/01, Chemistry of Nanotechnology, MARUZEN, 2005, 07, Textbook, Cocompilation, 4621073273

Invited Lecture, Oral Presentation, Poster Presentation

  1. Signal-Flow-Graph Analysis of Weakly Nonlinear Microwave Circuits Around a Large-Signal Operating Point, Shuhei Amakawa, Ryotaro Sugimoto, Korkut Kaan Tokgoz, Sangyeop Lee, Hiroyuki Ito, and Ryoko Kishikawa, Radio Wireless Week, 2023/01/22, Without Invitation, English, San Antonio, Texas, USA
  2. Measurement and modeling for sub-THz CMOS design: Challenges and opportunities, Shuhei Amakawa, Asia-Pacific Microwave Conference (APMC), 2023/12/08, Without Invitation, English
    Related URL
  3. X-parameters and metrology applications, Shuhei Amakawa, Asia-Pacific Microwave Conference (APMC), Workshop on Advanced Techniques and Applications for Large Signal Measurements and Characterization, 2023/12/05, With Invitation, English, Taipei, Taiwan
  4. On-chip transmission lines for silicon CMOS 6G: From basics to open questions, Shuhei Amakawa, 2023 International Conference on IC Design and Technology (ICICDT), 2023/09/25, With Invitation, English, Tokyo, Japan
    Related URL
  5. Design of silicon CMOS ICs and modules for 6G: With headaches, possible cures, and open questions in measurements, Shuhei Amakawa, 100th ARFTG Microwave Measurement Conference, 2023/01/25, With Invitation, English, This talk will present 300-GHz-band silicon CMOS ICs and transmitter and receiver modules for high-speed wireless communications. It will also cover behind-the-scenes measurement issues, including some progress that was essential to the successful demonstration of the sub-THz transceivers, and remaining headaches that await treatment.
    Related URL
  6. Visualizing small-signal responses of a nonlinear RF circuit under large-signal operating conditions, S. Amakawa, S. Lee, K. K. Tokgoz, and H. Ito, International Symposium on Biomedical Engineering (ISBE), 2021/12/03, Without Invitation, English
  7. Demonstration of non-invasive probing of CMOS devices with aluminum pads at frequencies up to 500 GHz, Shuhei Amakawa, R. Sakamaki, R. Kishikawa, Y. Tojima, S. Kon, I. Somada, S. Matsui, G. Taoka, T. Yoshida, and M. Fujishima, 99th Automatic RF Techniques Group Microwave Measurement Conference (ARFTG), 2022/06/24, Without Invitation, English, Boulder, Colorado, USA
    Related URL
  8. Towards RF circuit modeling for nearfield THz microscopy, B. Kaestner, A. Hoehl, V. Soltwisch, M. Pflueger, and S. Amakawa, International Symposium on Radio-Frequency Integration Technology (RFIT), 2020/09/02, With Invitation, English, Hiroshima
  9. Theoretical study of optimal feedback LNA design, K. Ono, S. Amakawa, International Symposium on Radio-Frequency Integration Technology (RFIT), 2020/09/04, Without Invitation, English
  10. Sub-THz CMOS transmission lines: Properties, characterization, and modeling, Shuhei Amakawa, International Symposium on Radio-Frequency Integration Technology (RFIT), 2020/09/02, With Invitation, English, IEEE
  11. Design theory of low-noise amplifier realizing the minimum noise measure using lossless feedback, Kosuke Ono, Takeshi Yoshida, Shuhei Amakawa, 2020/03/17, Without Invitation, Japanese
  12. CMOS circuit technology enabling terahertz wireless communications, Shuhei Amakawa, 2020/03/17, With Invitation, Japanese
  13. Theory of 2-port noise parameter transformation by lossless feedback and its application to LNA design, Kosuke Ono and Shuhei Amakawa, HISS, 2019/11/30, Without Invitation, Japanese
  14. 300-GHz-band CMOS transmitter and receiver modules with WR-3.4 waveguide interface, Shuhei Amakawa, IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G), 2019/08/15, With Invitation, English
    Related URL
  15. Wideband power-line decoupling technique for millimeter-wave CMOS integrated circuits, IEEE International Symposium on Circuits and Systems (ISCAS), 2019/05/29, With Invitation, English
    Related URL
  16. Characteristic impedance determination up to THz frequencies in light of causality, Global Symposium on Millimeter Waves (GSMM), 2019/05/23, With Invitation, English
    Related URL
  17. Feedback network design for transistor operating near its performance limit, Shuhei Amakawa, Emerging Technologies 2018 (ETCMOS), 2018/05/10, With Invitation, English, Whistler, Canada
  18. How does my microwave/EM simulator define complex-referenced S-parameters?, Shuhei Amakawa, Vietnam-Japan Microwave, 2017/06/14, With Invitation, English, Hanoi, Vietnam
  19. An 80–106 GHz CMOS amplifier with 0.5V supply voltage, Shuhei Amakawa, K. Katayama,K. Takano, T. Yoshida, M. Fujishima, K. Hisamitsu, and H. Takatsuka, IEEE Radio Frequency Integrated Circuits Symposium, 2017/06/06, Without Invitation, English, IEEE, Honolulu, Hawaii
    Related URL
  20. Prescriptions for identifying the definition of complex-referenced S-parameters in commercial EM simulators, Shuhei Amakawa, Yuya Kobayashi, The 38th PIERS in St Petersburg, 2017/05/22, Without Invitation, English, St. Petersburg
  21. 300GHz CMOS: From high-frequency measurement and device modelling to circuit design, Shuhei Amakawa, 2016/10/10, With Invitation, English, Cambridge, UK
  22. Graphical approach to analysis and design of gain-boosted near-fmax feedback amplifiers, Shuhei Amakawa, Y. Ito, European Microwave Conference, 2016/10/04, Without Invitation, English, London, UK
    Related URL
  23. A QAM-capable 300-GHz CMOS transmitter, Shuhei Amakawa, K. Katayama, K. Takano, S. Hara, A. Kasamatsu, K. Mizuno, K. Takahashi, T. Yoshida, and M. Fujishima, International Workshop on Smart Wireless Communications (SmartCom), 2016/05/17, With Invitation, English, Oulu, Finland
    Related URL
  24. Concepts and methods in on-wafer RF and microwave measurements, Shuhei Amakawa, International Conference on Microelectronic Test Structures (ICMTS), 2016/03/28, With Invitation, English, Yokohama
    Related URL
  25. Demystifying S parameters: Confusion surrounding S-parameter definitions, Shuhei Amakawa, MWE 2015, 2015/11/27, With Invitation, Japanese
    Related URL
  26. Comparative analysis of on-chip transmission line de-embedding techniques, Shuhei Amakawa, K. Katayama, K. Takano, T. Yoshida and M. Fujishima, International Symposium on Radio-Frequency Integration Technology (RFIT), 2015/08/27, Without Invitation, English, Sendai, Japan
  27. Power line decoupling up to 325 GHz in CMOS, Shuhei Amakawa, R. Goda, K. Katayama, K. Takano, T. Yoshida, and M. Fujishima, Vietnam-Japan Microwave (VJMW), 2015/08/10, With Invitation, English, Ho Chi Minh City, Vietnam
  28. Power line decoupling up to 325 GHz in CMOS, Shuhei Amakawa, R. Goda, K. Katayama, K. Takano, T. Yoshida, and M. Fujishima, Thailand-Japan Microwave (TJMW), 2015/08/08, With Invitation, English, Bangkok, Thailand
  29. Wideband CMOS decoupling power line for millimeter-wave applications, Shuhei Amakawa, R. Goda, K. Katayama, K. Takano, T. Yoshida, and M. Fujishima, IEEE MTT-S International Microwave Symposium (IMS), 2015/05/21, Without Invitation, English, IEEE MTT-S, Phoenix, Arizona
  30. On-wafer transmission line measurement above 100 GHz, Shuhei Amakawa, Amakawa, Shuhei; Katayama, Kosuke; Takano, Kyoya; Yoshida, Takeshi; Fujishima, Minoru, Thailand-Japan Microwave (TJMW), 2014/11/27, With Invitation, English, Bangkok, Thailand, It is well known that very long transmission lines are required to cover low frequencies by the thru-reflect-line (TRL) calibration algorithm, which also provides a solid foundation for propagation constant measurement. An obvious corollary might seem that only short lines are required to measure the propagation constant at high frequencies. Experimental results up to 325 GHz suggest that that is not the case. Very long lines are actually required to reliably evaluate the attenuation constant, especially above 100 GHz.
  31. Theory of gain and stability of small-signal amplifiers with lossless reciprocal feedback, Shuhei Amakawa, Asia-Pacific Microwave Conference (APMC), 2014/11/07, Without Invitation, English, Sendai, Japan, The gain and the stability of composite amplifiers consisting of a core 2-port amplifier and a lossless reciprocal embedding network is studied theoretically with particular interest in the design of near-fmax amplifiers. Design equations for finding an optimal embedding network that gives the highest MAG (maximum available gain) under a given stability requirement are presented. How such an embedding network could be synthesized is briefly sketched.
    Related URL
  32. Design of well-behaved low-loss millimetre-wave CMOS transmission lines, Shuhei Amakawa, 18th IEEE Workshop on Signal and Power Integrity (SPI), 2014/05/12, Without Invitation, English, Ghent, Belgium, It is a challenge to design single-mode transmission lines for above 100 GHz following strict design rules of modern CMOS processes. This paper reports characteristics of three types of microstrip lines in 65nm CMOS up to 325 GHz, designed with or without using an auto-dummy exclusion layer. The lowestloss design among the three is a shielded microstrip protected with an exclusion layer. The metal density requirement is met, as is commonly done, by placing sidewalls as far from the signal line as allowed by the design rules. The other two designs are microstrips without sidewalls or the exclusion layer. One of them has high-density auto dummy fill inserted by the foundry and shows significantly higher attenuation than the shielded microstrip. The other is filled with low-density fill that prevents auto dummy fill from being inserted. It is only marginally lossier than the shielded microstrip. The microstrips without sidewalls are found to exhibit more well-behaved attenuation especially above 100 GHz. The frequency dependence of the attenuation of the shielded microstrip, on the other hand, exhibits ripples, indicating possible presence of spurious modes. Attenuation constants estimated by multiline TRL (thru-reflect-line) from lines of various lengths indicate that the longest line measured should be very long, perhaps 2mm or longer, for the estimates to be reliable.
    Related URL
  33. Millimeter-wave on-wafer measurements: Headaches and possible cures, Shuhei Amakawa, MWE 2021, 2021/11/26, With Invitation, Japanese, Yokohama, Japan
    Related URL

Awards

  1. 2023/03/10, Best Contributed Paper Award, IEEE EDTM 2023 General Chair, Variable-temperature broadband noise characterization of MOSFETs for cryogenic electronics: From room temperature down to 3K
  2. 2017/09/01, IEEE International Symposium on Radio-Frequency Integration Technology RFIT Award, IEEE International Symposium on Radio-Frequency Integration Technology General Chair
  3. 2019/05/23, Global Symposium on Millimeter Waves 2019 (GSMM 2019) Best Paper Award, GSMM2019 General ChairGSMM2019 Award Committee Chair, 300-GHz Wireless Data Transmission System with Low-SNR CMOS RF Front End
  4. 2015, IEEE International Symposium on Radio-Frequency Integration Technology RFIT Award, Compact 138-GHz amplifier with 18-dB peak gain and 27-GHz 3-dB bandwidth
  5. 2020/02/17, 2020 IEEE International Solid-State Circuits Conference 2019 Demonstration Session Certificate of Recognition, International Solid-State Circuits Conference (2020 ISSCC), An 80Gb/s 300GHz-Band Single-Chip CMOS Transceiver

Patented

  1. Patent, JP第5143874号
  2. Patent, JP第5053413号
  3. Patent, JP第4881985号
  4. Patent, JP第5015210号

External Funds

Acceptance Results of Competitive Funds

  1. KAKENHI, 2013, 2014
    Permalink
  2. KAKENHI, Study of substrate bias effect on MOSFET variability, 2007, 2008
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  3. KAKENHI, Signal Integrity of Nano-Scale interconnect and Circuit, 2006, 2009
    Permalink
  4. KAKENHI, Development of On-chip Nano-Scale Network Based on Communication Theory, 2004, 2007
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  5. KAKENHI, 2016, 2018
  6. Program for Creating STart-ups from Advanced Research and Technology（START）, 2016/04/01, 2017/03/31

Social Activities

Organizing Academic Conferences, etc.

  1. European Conference on Networks and Communications (EuCNC), Technical Programme Committee Track Co-Chair, 2023/06, 2024/06
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  2. International Solid-State Circuits Conference, RF Subcommittee Member, 2019/03, 2022/02
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  3. 2020 IEEE International Symposium on Radio-Frequency Integration Technology, TPC Subcomittee Chair, 2020/01, 2020/09
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  4. Design, Test, Integration & Packaging of MEMS/MOEMS, Programme Committee, 2013/, 2016/
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  5. Microwave Workshops & Exhibition, Technical Program Committee, 2016/01, 2016/12
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  6. 2017IEEE International Symposium on Radio-Frequency Integration Technology, Technical Program Committee Member, 2016/01, 2017/09
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  7. 2018 IEEE International Symposium on Radio-Frequency Integration Technology, Technical Program Committee, 2017/12, 2018/08
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  8. 2018 Asia-Pacific Microwave Conference, Technical Program Committee, 2017/11, 2018/12
  9. Design, Test, Integration & Packaging of MEMS/MOEMS 2017, Programme Committee, 2016/, 2017/
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History as Peer Reviews of Academic Papers

  1. 2023, IEEE Journal of Solid-State Circuits, Others, Reviewer, 2
  2. 2023, Electronics Letters, Others, Reviewer, 1
  3. 2023, IEEE Transactions on Terahertz Science and Technology, Others, Reviewer, 1
  4. 2020, IEICE Electronics Express, Others, Reviewer, 1
  5. 2020, IEEE Journal of Solid-State Circuits, Others, Reviewer, 7
  6. 2020, Electronics Letters, Editor, Associate Editor, 1
  7. 2019, IEICE Electronics Express, Others, Reviewer, 1
  8. 2019, IEEE Terahertz Science and Technology, Others, Reviewer, 1
  9. 2019, IEEE Access, Others, Reviewer, 1
  10. 2019, Electronics Letters, Editor, Associate Editor, 25
  11. 2014, IEICE Transactions on Electronics, Editor, Associate Editor
  12. 2014, Japanese Journal of Applied Physics, Reviewer
  13. 2014, IEICE Electronics Express, Reviewer
  14. 2014, IEEE Microwave and Wireless Components Letters, Reviewer
  15. 2014, Electronics Letters, Reviewer, 4
  16. 2015, Electronics Letters, Editor, Associate Editor, 14
  17. 2015, IEEE Sensors Journal, Others, Reviewer, 1
  18. 2015, IEEE Transactions on Circuits and Systems I, Others, Reviewer, 1
  19. 2015, IEICE Electronics Express, Others, Reviewer, 2
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