JIAWEN YU

Last Updated :2026/04/03

Affiliations, Positions
Graduate School of Advanced Science and Engineering, Assistant Professor (Special Appointment)
E-mail
yujiawenhiroshima-u.ac.jp
Self-introduction
Temperature monitoring during semiconductor processing, machine learning

Basic Information

Educational Backgrounds

  • Hiroshima University, Graduate School of Advanced Science and Engineering, 2022/04, 2025/03
  • Hiroshima University, Graduate School of Advanced Science and Engineering, 2020/09, 2022/03

Academic Degrees

  • Hiroshima University
  • Hiroshima University

Research Fields

  • Engineering;Electrical and electronic engineering;Electron device / Electronic equipment
  • Informatics;Human informatics;Intelligent robotics

Research Keywords

  • Semiconductor processing; Temperature measurement, Interfacial thermal resistance, Machine Learning

Affiliated Academic Societies

  • The Japan Society of Applied Physcis

Research Activities

Academic Papers

  1. Ultra-low-temperature formation of high-quality SiO2 via interface-driven self-organization of polysilazane induced by atmospheric pressure plasma jet irradiation, AIP ADVANCES, 15(10), 20251001
  2. Optimization of Baking Temperature for Minimization of Interfacial Thermal Resistance in Polymer/SiC Bilayer Structure Using Optical-Interference Contactless Thermometry (OICT), 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 231-232, 20250521
  3. Investigation on the Relationship between Etching Rate and Photoresist Surface Temperature during Reactive Atmospheric-pressure Thermal Plasma Jet Irradiation, 2024 International Symposium on Semiconductor Manufacturing (ISSM), 1-3, 20250214
  4. Ultra-fast etching of photoresist by reactive atmospheric-pressure thermal plasma jet with surface temperature measurement, Applied Physics Express, 18, 016503, 20250117
  5. Measurement of Temperature-Dependent Interfacial Thermal Resistance at polymer/SiC Interface Based on Optical-Interference Contactless Thermometry, Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials, D-8-02, 20240904
  6. Extraction of interfacial thermal resistance across an organic/semiconductor interface using optical-interference contactless thermometry, Applied Physics Express, 17, 036502, 20240306
  7. Interfacial Thermal Resistance Measurement at Polymer/Semiconductor Interface Using Optical-Interference Contactless Thermometry (OICT), 2023 IEEE 4th China International Youth Conference On Electrical Engineering (CIYCEE), 1-5, 20240129
  8. Measurement of Heat Dissipation between SiC and Thermal Interface Material in Power Device Packaging Based on Optical-Interference Contactless Thermometry, Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials, N-2-03, 20230906
  9. Development of a real-time temperature measurement technique for SiC wafer during ultra-rapid thermal annealing based on optical-interference contactless thermometry (OICT), Japanese Journal of Applied Physics, 62, SC1075, 20230220
  10. Development of a Real-Time Temperature Measurement Technique for SiC Wafer During Ultra-Rapid Thermal Annealing Based on Optical-Interference Contactless Thermometry (OICT), Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials, J-5-04, 20220928

Invited Lecture, Oral Presentation, Poster Presentation

  1. Study on the Performance Improvement of Optical-Interference Contactless Thermometry Based on Machine Learning, Jiawen Yu, Hiroaki Hanafusa, and Seiichiro Higashi, 10th International Symposium on Control of Semiconductor Interface (ISCSI-X), 2025/11/10, Without Invitation, English, Tokyo, Japan
  2. Study on Real-Time Temperature Measurement Using Optical-Interference Contactless Thermometry (OICT) Based on Machine Learning, Jiawen Yu, Hiroaki Hanafusa, and Seiichiro Higashi, International Workshop on Nanodevice Technologies 2025 (IWNT2025), 2025/10/30, Without Invitation, English, Higashihiroshima, Japan
  3. Study on Real-Time Temperature Measurement Using Optical-Interference Contactless Thermometry (OICT) Based on Machine Learning, Jiawen Yu, H. Hanafusa, and S. Higashi, 2025/10/23, Without Invitation, Japanese
  4. Study on the Performance Improvement of Optical-Interference Contactless Thermometry Based on Machine Learning, Jiawen Yu, H. Hanafusa, and S. Higashi, The 86th JSAP Autumn Meeting 2025, 2025/09/07, Without Invitation, Japanese
  5. Study on the Application of Machine Learning to Optical-Interference Contactless Thermometry, Jiawen Yu, H. Hanafusa, and S. Higashi, 2025/07/26, Without Invitation, Japanese
  6. Baking Temperature Optimization for Reducing Interfacial Thermal Resistance in Polymer/SiC Bilayer Structure Using Optical-Interference Contactless Thermometry (OICT), Jiawen Yu, Hiroaki Hanafusa, and Seiichiro Higashi, 2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025), 2025/04/15, Without Invitation, English, Nagano, Japan
  7. Real-time Visualization of 3D Temperature Distribution in SiC Wafers During Ultra-Rapid Thermal Annealing Using Optical-Interference Contactless Thermometry, Jiawen Yu, H. Hanafusa, and S. Higashi, The 72nd JSAP Spring Meeting 2025, 2025/03/14, With Invitation, Japanese, The Japan Society of Applied Physics, Noda Campus, Tokyo University of Science
  8. Measurement of Temperature-Dependent Interfacial Thermal Resistance at polymer/SiC Interface Based on Optical-Interference Contactless Thermometry, Jiawen Yu, Hiroaki Hanafusa, and Seiichiro Higashi, 2024 International Conference on Solid State Devices and Materials (SSDM 2024), 2024/09/01, Without Invitation, English, Yokohama, Japan
  9. Interfacial Thermal Resistance Measurement at Polymer/Semiconductor Interface Using Optical- Interference Contactless Thermometry (OICT), Jiawen Yu, Hiroaki Hanafusa, Seiichirou Higashi, The 2nd China International Youth Conference On Electrical Engineering (CIYCEE 2021), 2023/12/15, Without Invitation, English, Chengdu, China
  10. MEASUREMENT OF TRANSIENT HEAT TRANSFER ACROSS ORGANIC/SEMICONDUCTOR INTERFACE USING OPTICAL-INTERFERENCE CONTACTLESS THERMOMETRY (OICT), Jiawen Yu, R. GOTO, H. HANAFUSA and S. HIGASHI, 33rd International Symposium on Transport Phenomena (ISTP-33), 2023/09/24, Without Invitation, English, Kumamoto, Japan
  11. Measurement of Heat Dissipation between SiC and Thermal Interface Material in Power Device Packaging Based on Optical-Interference Contactless Thermometry, Jiawen Yu, Ryunosuke Goto, Hiroaki Hanafusa, and Seiichiro Higashi, 2023 International Conference on Solid State Devices and Materials (SSDM2023), 2023/09/05, Without Invitation, English, Nagoya, Japan
  12. Extraction of Organic/Semiconductor Interfacial Thermal Resisitance based on Optical Interference Contactless Thermometry (OICT), Jiawen Yu, Hiroaki Hanafusa, and Seiichiro Higashi, 2023 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD2023), 2023/07/10, Without Invitation, English, Tokyo, Japan
  13. Development of a Real-Time Temperature Measurement Technique for SiC Wafer During Ultra-Rapid Thermal Annealing Based on Optical-Interference Contactless Thermometry (OICT), Jiawen Yu, Kotaro Matsuguchi , Takuma Sato , Hiroaki Hanafusa and Seiichiro Higashi, 2022 International Conference on Solid State Devices and Materials (SSDM2022), 2022/09/26, Without Invitation, English, Chiba, Japan
  14. Research on Real-Time Temperature Measurement For SiC Wafer During Ultra-Rapid Thermal Annealing Based On Optical-Interference Contactless Thermometry (OICT), Jiawen Yu, Keiya Fujimoto, Kotaro Matsuguchi, Takuma Sato, Hiroaki Hanafusa and Seiichiro Higashi, International Workshop on Nanodevice Technologies 2022 (IWNT2022), 2022/03/11, Without Invitation, English, Higashihiroshima, Japan